|
| Brand Name: | YOUWEI |
| Model Number: | YW-35254Z1 |
| MOQ: | 100 |
| Price: | USD 3.5-4.5 UNIT |
| Delivery Time: | 5-7 working days |
| Payment Terms: | T/T, Western Union, MoneyGram, D/A, L/C,Paypal |
Centimeter-to-meter level accuracy with multi-constellation support (GPS/GLONASS/Galileo/BeiDou).
Optimized power management for extended battery life (e.g., <1mA in sleep mode).
NMEA 0183 compliant protocols, with customizable message formats.
Supports UART, I2C, SPI, USB, and CAN bus for flexible integration.
Compatible with 2.7V–5.5V inputs, ideal for industrial and battery-powered applications.
Miniaturized form factor (e.g., 12mm × 16mm) for space-constrained installations.
Standardized connectors (e.g., JST, SMA) for effortless deployment.
Ruggedized for drones, vehicles, wearables, and IoT devices (-40°C to +85°C rated).
Tailored firmware, antenna designs, and housing options upon request.
Parameters of YW-16162G3 Global Positioning System Module
| Item | Parameters |
| Part No. | YW-35254Z1 |
| Chip | As per order |
| Frequency | L1 |
| Number of Channels | As per order requirements |
| Positioning Accuracy | 2 to 5meters |
| Velocity | 515 m/s |
| Velocity Accuracy | Without aid : 0.1m/s |
| TTFF | Hot start: 1 second typical |
| Sensitivity | Tracking Sensitivity: -162 dBm |
| Baud Rate | 9600 bps (default) or customized |
| Navigation Update Rate | 1Hz (default), maximum 10Hz |
| Timing Accuracy | 25 ns RMS |
| Interface Options | UART, I2C, SPI, USB, CAN |
| Data Output Format | NMEA 0183 |
| Power Supply | 3V ~ 5V |
| Working Temperature Range | -40°C to 85°C |
| Antenna Type | patch ceramic antenna |
| AGPS | Supported |
| Dimension | 35*25*4mm |
| Package Type | SMD |
| Origin Place | China |
| Export Packing | Tray/Carton |
| Step | Process Description | Key Activities |
| 1 | Requirements Analysis | Define functional specs (e.g., AT commands, protocols). |
| 2 | Dev Environment Setup | Configure IDE/toolchain (e.g., Keil, GCC). |
| 3 | Algorithm Optimization | Enhance positioning accuracy/power efficiency. |
| 4 | Protocol Integration | Add TCP/UDP or custom communication protocols. |
| 5 | Driver Development | Hardware-software compatibility testing. |
| 6 | Maintainability Design | Modular code architecture for future upgrades. |
Deliverables: SDK package, AT command documentation, test reports.
2. APP & Web Development
| Step | Process Description | Key Activities |
| 1 | Requirement Finalization | Confirm features (e.g., geofencing, alerts). |
| 2 | UI/UX Design | Cross-platform responsive design (iOS/Android/Web). |
| 3 | API & Backend Development | RESTful APIs, database design (PostgreSQL/MongoDB). |
| 4 | Security Implementation | Data encryption (AES-256), OAuth 2.0 authentication. |
| 5 | Performance Tuning | Server load balancing, latency optimization. |
| 6 | Deployment & Testing | AWS/Azure deployment, stress testing (JMeter). |
Deliverables: Mobile apps (APK/IPA), admin dashboard, API documentation.
3. PCBA Turnkey Manufacturing
| Step | Process Description | Key Activities |
| 1 | Design Review | Schematic/PCB layout validation (Altium/Cadence). |
| 2 | Rapid Prototyping | 24-72hr PCB fabrication (4-6 layer options). |
| 3 | Component Sourcing | BOM procurement with OEM/ODM partners. |
| 4 | SMT Assembly | High-precision pick-and-place. |
| 5 | Functional Testing | In-circuit test (ICT), firmware flashing. |
| 6 | Quality Assurance | Burn-in testing, RoHS/REACH compliance checks. |
Deliverables: Tested PCBA units, compliance certificates, assembly logs.
4. GPS Hardware Customization
| Step | Process Description | Key Activities |
| 1 | Mechanical Design | Custom housing/antenna (3D modeling with SolidWorks). |
| 2 | RF Optimization | LNA circuit tuning, impedance matching. |
| 3 | Environmental Testing | Thermal cycling (-40°C to +85°C), vibration tests. |
| 4 | Signal Validation | Anechoic chamber testing, multi-constellation SNR analysis. |
| 5 | Mass Production | DFM review, mold/tooling fabrication. |
Deliverables: 3D design files, RF test reports, production jigs.
End-to-End Collaboration
Bilingual Support: Dedicated project managers with technical translators.
Agile Milestones: Bi-weekly sprints with demo sessions.
Post-Sales: OTA update portal, RMA process for hardware.
|
|
| Brand Name: | YOUWEI |
| Model Number: | YW-35254Z1 |
| MOQ: | 100 |
| Price: | USD 3.5-4.5 UNIT |
| Packaging Details: | Tray/Carton |
| Payment Terms: | T/T, Western Union, MoneyGram, D/A, L/C,Paypal |
Centimeter-to-meter level accuracy with multi-constellation support (GPS/GLONASS/Galileo/BeiDou).
Optimized power management for extended battery life (e.g., <1mA in sleep mode).
NMEA 0183 compliant protocols, with customizable message formats.
Supports UART, I2C, SPI, USB, and CAN bus for flexible integration.
Compatible with 2.7V–5.5V inputs, ideal for industrial and battery-powered applications.
Miniaturized form factor (e.g., 12mm × 16mm) for space-constrained installations.
Standardized connectors (e.g., JST, SMA) for effortless deployment.
Ruggedized for drones, vehicles, wearables, and IoT devices (-40°C to +85°C rated).
Tailored firmware, antenna designs, and housing options upon request.
Parameters of YW-16162G3 Global Positioning System Module
| Item | Parameters |
| Part No. | YW-35254Z1 |
| Chip | As per order |
| Frequency | L1 |
| Number of Channels | As per order requirements |
| Positioning Accuracy | 2 to 5meters |
| Velocity | 515 m/s |
| Velocity Accuracy | Without aid : 0.1m/s |
| TTFF | Hot start: 1 second typical |
| Sensitivity | Tracking Sensitivity: -162 dBm |
| Baud Rate | 9600 bps (default) or customized |
| Navigation Update Rate | 1Hz (default), maximum 10Hz |
| Timing Accuracy | 25 ns RMS |
| Interface Options | UART, I2C, SPI, USB, CAN |
| Data Output Format | NMEA 0183 |
| Power Supply | 3V ~ 5V |
| Working Temperature Range | -40°C to 85°C |
| Antenna Type | patch ceramic antenna |
| AGPS | Supported |
| Dimension | 35*25*4mm |
| Package Type | SMD |
| Origin Place | China |
| Export Packing | Tray/Carton |
| Step | Process Description | Key Activities |
| 1 | Requirements Analysis | Define functional specs (e.g., AT commands, protocols). |
| 2 | Dev Environment Setup | Configure IDE/toolchain (e.g., Keil, GCC). |
| 3 | Algorithm Optimization | Enhance positioning accuracy/power efficiency. |
| 4 | Protocol Integration | Add TCP/UDP or custom communication protocols. |
| 5 | Driver Development | Hardware-software compatibility testing. |
| 6 | Maintainability Design | Modular code architecture for future upgrades. |
Deliverables: SDK package, AT command documentation, test reports.
2. APP & Web Development
| Step | Process Description | Key Activities |
| 1 | Requirement Finalization | Confirm features (e.g., geofencing, alerts). |
| 2 | UI/UX Design | Cross-platform responsive design (iOS/Android/Web). |
| 3 | API & Backend Development | RESTful APIs, database design (PostgreSQL/MongoDB). |
| 4 | Security Implementation | Data encryption (AES-256), OAuth 2.0 authentication. |
| 5 | Performance Tuning | Server load balancing, latency optimization. |
| 6 | Deployment & Testing | AWS/Azure deployment, stress testing (JMeter). |
Deliverables: Mobile apps (APK/IPA), admin dashboard, API documentation.
3. PCBA Turnkey Manufacturing
| Step | Process Description | Key Activities |
| 1 | Design Review | Schematic/PCB layout validation (Altium/Cadence). |
| 2 | Rapid Prototyping | 24-72hr PCB fabrication (4-6 layer options). |
| 3 | Component Sourcing | BOM procurement with OEM/ODM partners. |
| 4 | SMT Assembly | High-precision pick-and-place. |
| 5 | Functional Testing | In-circuit test (ICT), firmware flashing. |
| 6 | Quality Assurance | Burn-in testing, RoHS/REACH compliance checks. |
Deliverables: Tested PCBA units, compliance certificates, assembly logs.
4. GPS Hardware Customization
| Step | Process Description | Key Activities |
| 1 | Mechanical Design | Custom housing/antenna (3D modeling with SolidWorks). |
| 2 | RF Optimization | LNA circuit tuning, impedance matching. |
| 3 | Environmental Testing | Thermal cycling (-40°C to +85°C), vibration tests. |
| 4 | Signal Validation | Anechoic chamber testing, multi-constellation SNR analysis. |
| 5 | Mass Production | DFM review, mold/tooling fabrication. |
Deliverables: 3D design files, RF test reports, production jigs.
End-to-End Collaboration
Bilingual Support: Dedicated project managers with technical translators.
Agile Milestones: Bi-weekly sprints with demo sessions.
Post-Sales: OTA update portal, RMA process for hardware.
